精材科技股份有限公司 2016 Sustainability Report

Report summary

• This page summarizes the 2016 sustainability report and ESG report PDF source for 精材科技股份有限公司 (3374).
• The reporting period is 2016/01/01 to 2016/12/31; industry is 半導體業; capital range or filing reason is 6.股本達新臺幣五十億元以上者,但未達新臺幣一百億元以上者.
• Third-party information lists verification body 香港商英國標準協會太平洋有限公司台灣分公司(BSI). Use it to check the report’s verification, assurance, and disclosure standards.
• Compare public disclosure approaches across prior-year and peer reports. Your company’s actual disclosures must still be based on its own data and supporting evidence.

Report details

Company

精材科技股份有限公司（3374）

Reporting Year

2016

Disclosure Period

2016/01/01 to 2016/12/31

Industry

半導體業

Third-party information

Third-party information lists verification body 香港商英國標準協會太平洋有限公司台灣分公司(BSI)

PDF source

The original ESG report PDF can be downloaded or opened from this page

How to use this report

• Compare how 精材科技股份有限公司 structured 半導體業 sustainability report chapters and material topics in 2016.
• Confirm the reporting period, listed third-party verification or assurance provider information, and the downloadable ESG report PDF source.
• Mark public disclosures and original page numbers that can be referenced as research materials for planning chapters and indicators for your own company.

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半導體業 · 2016